PCB material composition
Mar 30, 2022
The main material used to manufacture PCB (Printed Circuit Board) is very important. The properties of
the material in terms of temperature resistance, adhesion, tensile strength,
flexibility, dielectric strength, dielectric constant and many other physical,
electrical and thermal factors must be considered. The performance and level of
integration of a PCB is entirely dependent on the materials used to manufacture
the PCB.
FR-4 is made of fiberglass,
also known as FR4, the letters FR stand for "flame retardant". This
substrate layer provides a solid foundation for the PCB, although the thickness
will vary depending on the application of a given board.
Copper Clad Laminate (CCL) is
a product made of wood pulp paper or glass fiber cloth as reinforcement
material, impregnated with resin, single-sided or double-sided copper-clad
foil, and hot pressed.
Classification criteria |
Material |
|
reinforcement Material |
PF resins (XPC, FR1, FR2) |
PF resins (XPC, FR1, FR2) Epoxy resin (FE-3) polyester resin |
Epoxy resin (FE-3) |
Epoxy resin (FR4, FR5) |
|
Composite Epoxy (CEM) |
/ |
|
Laminated multi-layer base class |
/ |
|
Special material base class |
BT、PI、PPO、MS |
|
flammable
|
Fireproof |
UL94-VO、UL94-V1 |
Non-fireproof |
UL-94-HB |
|
CCL performance |
CCL with general performance |
/ |
Low dielectric constant copper clad laminate |
/ |
|
High heat resistant copper clad laminate |
/ |
|
CCL with low thermal expansion coefficient |
/ |