1. Meet RoHs requirements;

2. More suitable for SMT processing technology;

3. In the circuit design scheme, the thermal diffusion is extremely effectively treated, thereby reducing the operating temperature of the module, extending the service life, and improving the power density and reliability;

4. Reduce the assembly of radiators and other hardware (including thermal interface materials), reduce product volume, and reduce hardware and assembly costs;

5. Optimal combination of power circuit and control circuit;

6. Replace fragile ceramic substrates to obtain better mechanical durability