— SERVICE CASES —
Bluetooth headset 6-layers Flexible and hard board case
Our company specializes in providing customers with 2-50 layers of precision printed circuit boards, high frequency antenna substrates, flexible circuit boards, and flexible and hard boards in accordance with high standards. The company has an excellent development and manufacturing team to provide customers with one-stop service from development and design, product testing to production and processing. For customers in different industries, customize the product manufacturing process and provide advanced product manufacturing and testing solutions. The following is the case of a factory's six-layer Bluetooth headset flexible and hard board.The following is a detailed description :
Number of layers
Outer copper thickness
Inner layer copper thickness
Minimum line width / line spacing
Difficulties in the process
strict requirements for impedance matching
At present, Xianglong (Shenzhen) Technology Co., Ltd. is one of the most competitive enterprises in the domestic high-end printed circuit board industry, and it will be our goal to create a famous brand in the printing Board industry. If you have any needs, Welcome to contact us.
PBCdesign of smart mobile phone
Product： Support dual SIM dual standby GSM/CDMA, 24bit real color display 7-inch capacitive touch screen module，Wi-Fi，Bluetooth，SD card expansion，Stereo speaker and high resolution camera.
Dual mode smart mobile phone
800*480 or 1024*600
Temperature of work
-20℃ ~ 70℃
-30℃ ~ 80℃
Single panel， physical pins 3000 Pin，density higher than 0.05 (board size / 14 pin-components )；6 layers PCB，5 layers single/power（Including surface layer），1 layer GND.
Dual-mode phone，including two groups baseband circuit，two groups SIM card circuit and other peripheral circuit，Layout routing is very difficult，Mixed interleaving of various digital analog signals. It is necessary to ensure the quality of all kinds of digital analog signals as well as the distribution of all networks. The structure size and the number of design layers are limited. There is no compromise expansion space. The layout and wiring density is high, and the design is difficult.
Solution: our technician evaluated the customer's requirements, it has achieved the structure size required by the customer. In the case of interleaving of various digital and analog signals, it adopts the processing measures of all analog signals including ground processing, avoiding the high-speed digital signals of the adjacent layer, and maintaining the integrity of the ground plane of the reference layer, so as to ensure the signal quality. The products are delivered to the customers according to the scheduled time limit, which is affirmed by the customers.