— SERVICE CASES —
Speaking of smart locks, I believe that everyone is no longer unfamiliar, and all walks of life have lost their presence on the portal. Smart locks are improved on the basis of traditional mechanical locks, they have three advantage, Such as more secure, convenient, and manageable.
we are going to introduce today is one of the PCB boards used in the smart door lock. This is the latest smart lock PCB board designed by the smart lock-manufacturer. Currently still in the proofing and testing section.
Product Name | Smart lock circuit board |
Number of layers | double-sided |
Minimum line width | 0.2mm |
Minimum line spacing | 0.26mm |
Minimum via hole | 0.90 mm |
Surface treatment | HAL |
Inner layer PTH to line minimum distance | 0.15 mm |
Solder mask | green oil |
Drilling thickness to diameter ratio | 2:5 |
Silk screen | white |
Copper thickness | copper ≥ 35 mm,hole copper ≥ 25 mm |
Thickness | 2.0 mm |
Insulation Resistance | 50 ohms |
Size | 46.5*37.9mm |
Warpage | ≤0.7% |
Outer copper thickness | 1.5oz |
Minimum aperture | 0.15mm |
Impedance | 50 ohm impedance ±10% control |
Minimum hole copper | 25um |
Tolerance | ±0.25mm |
Tin thickness | 2.45mm |
Product use | PCB |
Bluetooth headset 6-layers Flexible and hard board case
Our company specializes in providing customers with 2-50 layers of precision printed circuit boards, high frequency antenna substrates, flexible circuit boards, and flexible and hard boards in accordance with high standards. The company has an excellent development and manufacturing team to provide customers with one-stop service from development and design, product testing to production and processing. For customers in different industries, customize the product manufacturing process and provide advanced product manufacturing and testing solutions. The following is the case of a factory's six-layer Bluetooth headset flexible and hard board.The following is a detailed description :
Number of layers | 6L |
Structure | 2R+2F+2R |
Board thickness | 0.6mm |
Outer copper thickness | 1⁄3 OZ |
Inner layer copper thickness | 1⁄3 OZ |
Minimum aperture | 0.2mm |
Minimum line width / line spacing | 3mil |
Product use | sports headphones |
Surface finished | OSP |
Product use | sports headphones |
Difficulties in the process | strict requirements for impedance matching |
At present, Xianglong (Shenzhen) Technology Co., Ltd. is one of the most competitive enterprises in the domestic high-end printed circuit board industry, and it will be our goal to create a famous brand in the printing Board industry. If you have any needs, Welcome to contact us.
PBCdesign of smart mobile phone
Product: Support dual SIM dual standby GSM/CDMA, 24bit real color display 7-inch capacitive touch screen module,Wi-Fi,Bluetooth,SD card expansion,Stereo speaker and high resolution camera.
Item name | Dual mode smart mobile phone |
Color format | RGB888(or RGB565) |
Color bit | 24 |
Memory capacity | No |
LCD resolution | 800*480 or 1024*600 |
Touch type | capacitance |
Touch points | 5 points |
Temperature of work | -20℃ ~ 70℃ |
Storage temperature | -30℃ ~ 80℃ |
Outline size | 92mm*180mm |
Design parameter:
Single panel, physical pins 3000 Pin,density higher than 0.05 (board size / 14 pin-components );6 layers PCB,5 layers single/power(Including surface layer),1 layer GND.
Design difficulty:
Dual-mode phone,including two groups baseband circuit,two groups SIM card circuit and other peripheral circuit,Layout routing is very difficult,Mixed interleaving of various digital analog signals. It is necessary to ensure the quality of all kinds of digital analog signals as well as the distribution of all networks. The structure size and the number of design layers are limited. There is no compromise expansion space. The layout and wiring density is high, and the design is difficult.
Solution: our technician evaluated the customer's requirements, it has achieved the structure size required by the customer. In the case of interleaving of various digital and analog signals, it adopts the processing measures of all analog signals including ground processing, avoiding the high-speed digital signals of the adjacent layer, and maintaining the integrity of the ground plane of the reference layer, so as to ensure the signal quality. The products are delivered to the customers according to the scheduled time limit, which is affirmed by the customers.